• RF/Microwave Beamforming Networks (BFN), Butler Matrices, Passive IMAs (to 40GHz)
• Thick Film Ceramic Substrates and LTCC devices
• Microelectronic Hybrid Power Regulators, DC-DC Converters, Low Drop Out (LDOs Industrial, Military, and Space rad-hard)

minibend©, mini141© and microbend Cable Assemblies. SMPM-T, 90° Sweep Connectors, Hermetic Connectors and Adaptors, Coaxial to Waveguide Adaptors, Phase Shifters, Delay Lines, Quick Disconnect Waveguide Clamps. Connectors and Adaptors: BNC - TNC - SMA/SMB/SMC - N - 7/16 - Micro-Miniature Coaxial Connectors - MCX - MMCX - MMBX - Quick-Fit Connectors (N,7/16) for Corrugated Copper Cables. Cable, Cable Assemblies and Jumpers: Coaxial Semi-Rigid Cable - Sucoflex - Flexible and Sucoform - Semi-Flexible Cable - Delay Lines - Phase and Length Matched Assemblies. Lightning Protectors: Quarter-Wave and Surge Arrester Capsule EMPs. Antennas: 800 MHZ to 5.8 GHZ, Indoor/Outdoor, Mobile, and Rail

RFMD and TriQuint have combined to become Qorvo, the leader for scalable and dynamic Semiconductor Solutions. Amplifiers, Discrete Transistors and ICs, SAW and BAW Filters, Frequency Convertors, Oscillators, Passives, Switches, Phase Shifters, Attenuators, Modules

Millitech: Specializes in the Design, Engineering and Manufacturing of Millimeter-Wave Components, Assemblies, Subsystems and Fully Integrated Systems. Dedicated to providing the most Technically Advanced Millimeter-Wave Products and Services available

Tecom: Specialties uniquely address requirements for Satellite Communications. Products include, Flush Mount, Blade, Patch, Imbedded, GPS and Active Array Antennas. Positioners and Control Systems. TT&C, Telemetry, DF, SatCom, Linear Panel, Omni and Parabolic Antennas

Trak: Ferrite Devices (isolators and circulators), Microwave Subsystems - Local Oscillators, Reference Generators, Low g-sensitivity Frequency Sources, Exciters, Multipliers, Synthesizers, Receivers, Up/Down Converters, Signal Control Products (PIN), High Power Switches and Switched Filter Banks

Thermal Interface Materials, Heat Pipes and Sinks, Form in Place EMI Gasketing and Vacuum Metallization. Turn key solution and cutting edge technology (that can significantly reduce size and weight) for both assemblies and modules (both defense and commercial).